| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6e8683cde95e36ce68d18801b59bfbd4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate |
2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4337f706e1beb017cf3404b087acc67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5d5474ea12fdf7fa611f992df7f59ac |
| publicationDate |
2018-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201832278-A |
| titleOfInvention |
Method and apparatus for plasma cutting semiconductor wafers |
| abstract |
The invention provides a method for plasma cutting a substrate. The substrate has a top surface and a bottom surface. The top surface of the substrate has a plurality of cutting track regions and at least one device structure. The substrate is placed on a support film on a frame to form a workpiece. A processing chamber having a plasma source is provided. A workpiece support is provided in the plasma processing chamber. The workpiece is placed on the workpiece support. Plasma is generated from the plasma source in the plasma processing chamber. The workpiece is processed using the generated plasma and by-products generated from the support film when the support film is exposed to the generated plasma. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I814011-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I783395-B |
| priorityDate |
2016-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |