| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3299
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F28F27-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-673 |
| filingDate |
2017-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_864a6a85a6b987dd61750f361c9cf8a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ea2d0f54fabcb0cdfff3c4154ac549c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42598234702937e984d6f3a4d0bf5d75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a186818de6b2e9eb933cdfa621235ebc |
| publicationDate |
2018-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201810495-A |
| titleOfInvention |
Advanced temperature control for wafer carriers in plasma processing chambers |
| abstract |
This case describes an advanced temperature control system and method for a wafer carrier in a plasma processing chamber. In one example, the heat exchanger provides temperature controlled thermal fluid to the fluid passage of the workpiece carrier and receives thermal fluid from the fluid passage. A proportional valve is between the heat exchanger and the fluid passage to control the flow rate of the hot fluid from the heat exchanger to the fluid passage. The pneumatic valve is also between the heat exchanger and the fluid passage and also controls the flow rate of the hot fluid from the heat exchanger and the fluid passage. The temperature controller receives the measured temperature from the thermal sensor of the carrier and controls the temperature that the proportional valve and the pneumatic valve should measure back and forth to adjust the flow rate of the hot fluid. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I742579-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I702694-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I809122-B |
| priorityDate |
2016-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |