| abstract |
A resin element for connecting circuit elements, which is a film-like resin composition in which a phase electrode is electrically connected between opposing electrodes, wherein a glass transition temperature of a cured product of the resin composition is 150 to 350 ° C. And the average linear expansion coefficient at 0 to 130 ° C is 45 ppm or less. When the resin element is connected by such a circuit element, after the circuit elements are connected to each other, the connection resistance of the connection portion does not easily change, and the reliability is high. |