Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2865 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2891 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2887 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07307 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2865 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
filingDate |
2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_154c415f87459e249532e2ada9579e18 |
publicationDate |
2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201727242-A |
titleOfInvention |
Wafer inspection method and wafer inspection device |
abstract |
A wafer inspection method is provided that can appropriately receive the top of the suction cup. After the inspection of the wafer (W), when the aligner (32) receives the top (29) of the suction cup, the suction cups as the distance between the top (29) of the suction cup and the base (49) of the suction cup are held. The top height is such that the height of each of the front suction cup tops is uniformly increased by any of 0 μm to 200 μm, the inclination of the chuck base (49) is adjusted, and the distance between the top of the suction cup (29) and the suction cup base (49) is adjusted. |
priorityDate |
2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |