| abstract |
A film forming apparatus that mounts a substrate on a rotating table provided in a processing container, rotates the rotating table, and heats the substrate by a heating mechanism to perform a predetermined film forming process, and includes a contact type first temperature measuring mechanism. Measuring the temperature of the heating mechanism; the non-contact type second temperature measuring means measures the temperature of the substrate placed on the rotating table; and the control means is based on the first measured value measured by the first temperature measuring means and At least one of the second measured values measured by the second temperature measuring means controls the supplied electric power to the heating means; the control means is for performing a predetermined film forming process on the substrate, and the processing is performed When the container carries out the loading or unloading of the substrate, the method of controlling the power supply to the heating mechanism is changed. |