| abstract |
The photosensitive adhesive composition of the present invention is characterized in that it is used for bonding a semiconductor element and a member to be joined, and comprises (A) an alkali-soluble resin, (B) a photoacid generator, (C) an epoxy compound, And (D) a phenolic compound having a melting point of 50 to 150 °C. By using the cured product of the photosensitive adhesive composition of the present invention as an adhesive layer next to the semiconductor elements, bubbles (voids) can be reduced at the interface between the semiconductor element and the adhesive layer, and even if bubbles are generated at the interface, The resulting bubbles can be removed. As a result, the adhesion (adhesiveness) of the semiconductor elements can be improved. |