| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-147 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2015-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ce26b92aa1a74d4ec37df4e882360e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48e3670c36aff59b52bf28b1aa4a961c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea17ad9c4d290f279191aa15c97c5087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_768eda2a2562f2f735e00971b2d425b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e0aa7592f243382ca26e37e19eda520
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b369d78a4da0701f9329db7e5b1248a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32740714f45889c006c653c2b81b8322 |
| publicationDate |
2016-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201608689-A |
| titleOfInvention |
Method for forming three-dimensional wiring, circuit device having three-dimensional wiring, and metal film forming composition for three-dimensional wiring |
| abstract |
The present invention provides a circuit device having a three-dimensional wiring having a three-dimensional wiring having good conductivity, which is easy to manufacture under the relatively high productivity and at a relatively low manufacturing cost. When the circuit device 1 having the three-dimensional wiring electrically connected to the upper wiring 12a and the lower wiring 12b by the contact plug 14a is formed, the seed layer S constituting the contact plug 14a is selected by the pair containing the element period The coating film of the metal film forming composition of at least one of the metal salt of the Group 10 and the 11th group of the table is heated and formed. |
| priorityDate |
2014-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |