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filingDate 2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c87a654bcbfbbbfc4ac5b550953e79e
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publicationDate 2016-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201602389-A
titleOfInvention Semiconductor device manufacturing method, substrate processing device, and recording medium
abstract An object of the present invention is to form a film having a high carbon concentration.nThe solution of the present invention is to form a film containing a first element, a second element, and carbon on a substrate by performing a predetermined number of cycles in which the following steps are not performed simultaneously:nThe substrate is thermally decomposed with a raw material having a chemical bond of a first element and carbon, and is kept under the condition that at least a part of the chemical bond between the first element and the carbon contained in the raw material is not cut, thereby forming a material exceeding a step of forming a first solid layer having a thickness of 1 atomic layer or less and containing a chemical bond of a first element and carbon; and supplying a plasma-containing reactant containing a second element to the substrate, or supplying a plasma The step of modifying the first solid layer to form the second solid layer by exciting the inert gas and the reactant containing the second element which is not excited by the plasma.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I756612-B
priorityDate 2014-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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