abstract |
When the display device has higher definition, the number of pixels, gate lines, and signal lines increases; when the number of gate lines and signal lines increases, higher manufacturing cost problems arise because it is difficult to A bonding method or the like is used to mount an IC chip including a driver circuit for driving a gate line and a signal line. The pixel portion and the driver circuit for driving the pixel portion are disposed on the same substrate, and at least a portion of the driver circuit includes a thin film transistor using an oxide semiconductor, and the oxide semiconductor is interposed in the oxide semiconductor Between the upper and lower gate electrodes; therefore, when the pixel portion and the driver portion are disposed on the same substrate, the manufacturing cost can be reduced. |