| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6e8683cde95e36ce68d18801b59bfbd4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3211 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2014-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a25bc2855c84ba9606272ffb637c2c0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c021b46528ed30efd8dd1b89ae27db2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_279fedc5092bb682031f3e89c55b83f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6cafbf60ee8145769e6248f112605aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab81ed2014b7028208d91e861edaf098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4337f706e1beb017cf3404b087acc67 |
| publicationDate |
2015-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201515096-A |
| titleOfInvention |
Method and apparatus for plasma cutting semiconductor wafers |
| abstract |
The present invention provides a method for plasma treating a substrate, the method comprising: providing a processing chamber having a wall; providing a plasma source adjacent to the wall of the processing chamber; providing a workpiece in the processing chamber a support member; loading a workpiece onto the workpiece support, the workpiece having a support film, a frame, and the substrate; providing at least two cutting regions on the substrate, the cutting regions being disposed Between all adjacent device structures on the substrate; utilizing the plasma source to produce a plasma; and utilizing the generated plasma to process the workpiece. |
| priorityDate |
2013-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |