http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201510267-A

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filingDate 2014-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201510267-A
titleOfInvention Tungsten deposition with hexafluoride (WF6) etch back
abstract The implementations described herein are generally directed to methods of forming a tungsten material on a substrate using a vapor deposition process. The method comprises the steps of: positioning a substrate having features formed therein in a substrate processing chamber; depositing a first tungsten over the feature by introducing a continuous stream of hydrogen-containing gas and a tungsten halogen compound into the processing chamber Membrane to deposit a first film of the entire tungsten layer; using a plasma treatment to etch the first film of the entire tungsten layer to remove the first film by exposing the first film to a continuous flow of the tungsten halogen compound and the activation process gas a portion of a film; and depositing a second film of the monolithic tungsten layer by introducing a continuous stream of hydrogen-containing gas and a tungsten-halogen compound into the processing chamber to deposit a second tungsten film over the first tungsten film.
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