| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32431
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67115 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2014-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa9ed4faf7c193fcba07ee84fba606d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48cc8275e8b8157da1cd86fe43978e0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b84df34979b9ba8a5f3e34b04f311e7b |
| publicationDate |
2014-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201440141-A |
| titleOfInvention |
UV-assisted reactive ion etching for copper |
| abstract |
In some embodiments, a plasma etching apparatus for etching copper is provided, the plasma etching apparatus comprising (1) a plasma body having a processing chamber, the processing chamber being adapted to receive a substrate; and (2) coupling a radio frequency (RF) source to the RF electrode; (3) a susceptor located in the process chamber and adapted to support the substrate; and (4) being disposed during at least a portion of the etch process performed within the plasma etch device Ultraviolet light to the UV source of the process chamber. Many other aspects are also provided. |
| priorityDate |
2013-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |