http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201436104-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_31da94917d1067c89f7e22444c88a836 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76859 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76856 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate | 2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e70ca67c79e31fc9229d5c56ae76917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a652e02cf265fe420af9e7c50912e39c |
publicationDate | 2014-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-201436104-A |
titleOfInvention | Method of forming a barrier layer of a conductive copper structure |
abstract | An exemplary method disclosed herein includes: forming a groove/through hole in a layer of insulating material; forming a barrier layer in at least the groove/through hole; performing at least one process after forming the barrier layer Introducing manganese into the barrier layer and thereby defining a manganese-containing barrier layer; forming a substantially pure copper-based seed layer over the manganese-containing barrier layer; depositing a host copper-based material over the copper-based seed layer To overfill the grooves/through holes; and to remove excess material located outside the grooves/through holes thereby defining a copper-based conductive structure. |
priorityDate | 2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.