http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201436104-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76859
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e70ca67c79e31fc9229d5c56ae76917
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publicationDate 2014-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201436104-A
titleOfInvention Method of forming a barrier layer of a conductive copper structure
abstract An exemplary method disclosed herein includes: forming a groove/through hole in a layer of insulating material; forming a barrier layer in at least the groove/through hole; performing at least one process after forming the barrier layer Introducing manganese into the barrier layer and thereby defining a manganese-containing barrier layer; forming a substantially pure copper-based seed layer over the manganese-containing barrier layer; depositing a host copper-based material over the copper-based seed layer To overfill the grooves/through holes; and to remove excess material located outside the grooves/through holes thereby defining a copper-based conductive structure.
priorityDate 2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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