http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201421492-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d7639e244186dae4d15a0575c39cffc4 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y40-00 |
| filingDate | 2012-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_411ecd00b06b602422bcbe0a0fd03947 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30045cd778078b6777f348f190c2bb78 |
| publicationDate | 2014-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201421492-A |
| titleOfInvention | Patterning method of conductive interconnect structure of conductive film |
| abstract | A method of patterning a conductive interconnect structure of a conductive film, comprising the following steps. A conductive film is provided. The conductive film comprises a glue and a plurality of nano conductive structures. These nano-conductive structures are blended in the glue and form a conductive interconnect structure. An insulating mask layer is formed overlying a first portion of one surface of the conductive film and exposing a second portion of the surface of the conductive film. The surface of the conductive film is subjected to a plasma treatment to destroy the conductivity of the conductive interconnect structure under the second portion. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105573542-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105573542-B |
| priorityDate | 2012-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.