http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201405655-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_69ad1f2809edf0480609218e7949f09c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate | 2012-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d5f04715a412ccbe447fcdb64067019 |
| publicationDate | 2014-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201405655-A |
| titleOfInvention | Gas phase etching device with multi-cavity |
| abstract | The invention provides a gas phase etching device with multi-cavity, comprising a working cavity for etching an object by using a process gas, and generating residual gas, and the degassing cavity covers the working cavity, and the protective cavity is covered with degassing The cavity has a cavity pressure in the working cavity, the degassing cavity has a degassing pressure, the gas pressure in the protective cavity, and the cavity pressure is greater than the degassing pressure to discharge the residual gas, and the gas pressure is greater than the degassing pressure. The degassing pressure is squeezed to ensure that residual gas does not leak to the protective chamber, thereby preventing residual gas from leaking into the atmosphere. According to the technical idea of the present invention, it is possible to achieve an etching operation by carrying a special module through gas phase characteristics of different chemicals, so as to achieve a low cost, high etching rate, and at the same time, an excellent safety consideration design. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107023694-A |
| priorityDate | 2012-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.