| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bc905cbef116a1ec61d12125af9427f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2012-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26554e2b183c25d37836f528eb3112a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d9a236afa46eff44520ebf3fab6f17c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_728fe25cba8dc326028efd2cbd2a7883 |
| publicationDate |
2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201403768-A |
| titleOfInvention |
Substrate perforation structure |
| abstract |
A substrate perforated structure includes a substrate, a conductive layer, and a parasitic capacitance modulation layer. The substrate has at least one opening. The conductive layer fills the opening. The parasitic capacitance modulation layer is disposed between the conductive layer and the substrate. The parasitic capacitance modulation layer is used to reduce the parasitic capacitance around the substrate via. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I618191-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9972534-B1 |
| priorityDate |
2012-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |