| abstract |
The present invention discloses an adhesive film for a semiconductor and a semiconductor package using the same. The adhesive film forms an adhesive layer between the bump wafers to satisfy the electrical connection therebetween, allowing a fluxing process to remove the oxide layer between the Cu bumps and the solder, and exhibiting high fluidity for compression at high temperatures. A sufficient connection between the bumps and the solder is ensured during wafer bonding. |