| abstract |
The present invention provides a manufacturing apparatus, which can perform so-called sequential substrate transfer, even if there are a plurality of layers formed of a same kind of film in one multilayer thin film, and which can improve throughput. According to one embodiment of the present invention, a manufacturing apparatus is provided with: a transfer chamber (12), three sputtering film-forming chambers (13A, 13C, 13E), which are provided with one sputtering cathode; two sputtering film-forming chambers (13B, 13D), which are provided with two or more sputtering cathodes; and a process chamber (14) for performing process other than sputtering. The three sputtering film-forming chambers (13A, 13C, 13E), the two sputtering film-forming chambers (13B, 13D), and the process chamber (14) are disposed at the periphery of the transfer chamber (12) such that each of the chambers can transfer and receive substrates to and from the transfer chamber (12). |