| abstract |
Disclosed herein are an adhesive composition for a semiconductor device having high flowability, an adhesive film comprising the same, and a semiconductor package using the same. The composition includes a flux active curing agent having a particular structure and has satisfactory reliability of electrical connection between bump chips. Further, the composition enables a flux process of eliminating an oxide layer of a Cu bump and a solder by an adhesive layer between the bump chips, and enables a bump and a solder to be thoroughly connected to each other in chip bonding by thermal compression. |