| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af1aac0717028a45913e80d9e05fad8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2010-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_079ec320f1f76906993c7666137e2cc4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1b26b8a8ed530582b4fb8d5282ac320
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_889e5c3c0dcc749148220193dcee4f7c |
| publicationDate |
2012-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201220449-A |
| titleOfInvention |
A package structure having a micro-electromechanical element and a manufacturing method thereof |
| abstract |
A package structure having a micro-electromechanical element, comprising: a micro-electromechanical element having a plurality of electrical contacts; a package layer covering the micro-electromechanical element and the electrical contacts, and the bottom of the micro-electromechanical element exposed to a lower surface of the package layer; a plurality of solder wires embedded in the package layer, and one end of each of the solder wires connected to the electrical contact of the micro-electromechanical, while the other end exposed to the lower surface of the package layer; and a build-up layer structure provided on the lower surface of the package layer, and the build-up layer comprising at least one dielectric layer and a plurality of conductive holes formed in the dielectric layer and electrically connected to one end of the solder wire. The package structure of the present invention is easier to accurately control the location of an external electrical contact, and the compatibility of the manufacturing procedures is high so as to facilitate the reduction of the overall cost. The present invention further provides a method for manufacturing the package structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112265954-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112265954-A |
| priorityDate |
2010-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |