| abstract |
A negative photosensitive resin composition contains an alkali-soluble resin (A), a photopolymerization initiator (B), a polyfunctional monomer (C) and a zirconium compound (D). The carboxylic acid equivalent weight of the alkali-soluble resin (A) is 200 g/mol or more and is 1,400 g/mol or less. Provided is the negative photosensitive resin composition which is alkali developable, has excellent pattern workability, and can be cured by UV curing and thermal curing so as to obtain a hardened film having high hardness, high transparancy and excellent heat and humidity resistance. |