Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
filingDate |
2010-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f403b77a792bc6cf6b9ac0ea22d539d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9d60bad7a8a8105efa0f1c3f98f70c5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3180b6a0c6324ae1b0a02b8e8a740b78 |
publicationDate |
2011-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201111466-A |
titleOfInvention |
Sheet shaped adhesive agent and wafer-processing tape |
abstract |
This invention provides a sheet shaped adhesive agent and a wafer-processing tape produced by using the sheet shaped adhesive agent, in which the material is easy for storage, with high production efficiency, with few deterioration along with time and is easy for the sheet shaped adhesive agent to store. The sheet shaped adhesive agent (12) contains a curable resin curable by heat or high energy radiation, and an epoxy curing agent that cures the epoxy groups. A part of or all of the aforementioned curable resin is a chelating agent modified epoxy resin. The aforementioned curable resin component contains more than 10% by mass of the aforementioned chelating agent modified epoxy resin. |
priorityDate |
2009-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |