| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32ce12f8709350afe097badddf523729 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0751
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2009-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4c878ce3b8ecc3d3bd390b39dc4ca23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77abd3a129849d3dab9d06f5efdd33a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d01994ac4f92e3e79749d5a1ee8d5d86 |
| publicationDate |
2010-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201005008-A |
| titleOfInvention |
Heat-resistant resin precursor and photosensitive resin composition comprising the same |
| abstract |
Disclosed is a novel alkali-soluble resin which can be used in a photosensitive resin composition to impart high sensitivity to the composition, enables the formation of a pattern with a developing solution (an aqueous 2.38 wt% tetramethylammonium hydroxide solution) that is normally used in the process for producing a semiconductor device, and can be cured into a heat-resistant film having excellent mechanical strength, in other words, has a high glass transition temperature and enables a relief pattern to have excellent solubility in propylene glycol monomethyl ether after development. The alkali-soluble resin has, in its molecule, a structure represented by general formula (1) [wherein X1 represents a tetravalent organic group containing a halogen atom; Z1 represents a bivalent organic group represented by general formula (2) (wherein L1 or L1's and L2 or L2's independently represent a methyl group or a hydroxy group; and n1 and n2 independently represent an integer of 0 to 3); and m1 represents an integer of 1 to 200]. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I748065-B |
| priorityDate |
2008-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |