| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74973199515dbabd2310245aab03e282 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1744 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6732
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67778
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67748 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677 |
| filingDate |
2008-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88014991a51e4e16d98c4ddd6007b7cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4c5c93e040d6ab959bab16929f3ae4a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdf1349133de018fc7ee388eefdf10ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d2feee8f5cadff0272ef57a143caf15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f19a2f649df792ca59471bbf4c58475
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32817c341fc56b3d7ad583297ec9f2be
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91be166f0484b57b72555539b3bf5faf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35126cde46c9fd6bdec82932435639f3 |
| publicationDate |
2009-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200937543-A |
| titleOfInvention |
Room temperature wafer bonding apparatus |
| abstract |
The room temperature wafer bonding apparatus has an angular adjustment mechanism, a first drive, a second drive, a carriage table. The angular adjustment mechanism supports a first wafer table on a first stage and changes the direction of the first wafer table. The first drive drives the first stage in a first direction. The second drive drives a second wafer table in a second direction. The carriage table supports the second wafer table in the first direction, when wafers are bonded. The room temperature wafer bonding apparatus is able to give the wafers the load which is larger than withstand load of the second drive. The room temperature wafer bonding apparatus is able to make the wafers contact in parallel by modifying the direction of the first wafer by using the angular adjustment mechanism, and to load uniformly on the bonding surfaces. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9064910-B2 |
| priorityDate |
2008-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |