Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-905 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B7-0035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
filingDate |
1996-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1996-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-960043004-A |
titleOfInvention |
How to clean the vacuum processor |
abstract |
According to the cleaning method of the vacuum processing apparatus, the aluminum film formed on the semiconductor substrate and covered by the resist pattern is etched by the gas containing chlorine in the processing chamber of the vacuum processing apparatus and thereafter, the gas containing oxygen group and the gas containing fluorine group. And a plasma of a diluted gas of a mixed gas consisting of a gas containing a chlorine group is generated in a processing chamber to remove residual reaction products. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100531337-B1 |
priorityDate |
1995-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |