| abstract |
In the dicing of a semiconductor wafer, a protective film forming agent which is used to form a protective film on the surface of a semiconductor wafer and is capable of forming a protective film excellent in laser processability and excellent in solubility of a light absorbent, and a semiconductor using the protective film forming agent To provide a method for manufacturing a chip. It is set as the protective film forming agent containing a water-soluble resin (A), a light absorber (B), a basic compound (C), and a solvent (S). The basic compound (C) is preferably an alkylamine, an alkanolamine, an imidazole compound, ammonia, or a hydroxide of an alkali metal. As for content of the light absorber (B) in a protective film forming agent, 0.1 mass % or more and 10 mass % or less are preferable. |