| abstract |
Specific examples of the present invention relate to a sputter deposition apparatus comprising a guiding member for guiding a substrate in a conveyance direction, a plasma source for generating plasma, and a magnet arrangement. The magnet arrangement is configured to confine the plasma within the apparatus to a pre-treatment zone where the substrate is exposed to the plasma during use. The magnet arrangement is also configured to confine the plasma in the apparatus to a sputter deposition zone located after the pretreatment zone in the transport direction to sputter deposit the target material onto the substrate during use. A pretreatment zone and a sputter deposition zone are disposed around the guiding member. |