| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fda353b84ebf303bfc237d8bd8e22966 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2020-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b3fac168a35261abe1337421f62ac4d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a5f05dacb256cbcd3ed4e3b0ceaa819
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c371bd06ecb8d0c9d93969232957dab |
| publicationDate |
2022-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20220025804-A |
| titleOfInvention |
Resin composition for sealing, electronic component device, and manufacturing method of electronic component device |
| abstract |
A resin composition for sealing, comprising an epoxy resin and a curing agent containing an active ester compound, wherein an equivalent ratio of the active ester compound to the epoxy resin (active ester compound/epoxy resin) is 0.9 or less. |
| priorityDate |
2019-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |