| abstract |
Provided is an adhesive for mounting a semiconductor capable of controlling a gap with high precision when mounting a semiconductor and capable of increasing heat resistance. The adhesive for semiconductor mounting according to the present invention is an adhesive used for mounting a semiconductor, and includes a silicone resin and a spacer, and the content of the spacer is 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, The 10% compressive elastic modulus of the spacer is 5000 N/mm 2 or more and 15000 N/mm 2 or less, and the average particle diameter of the spacer is 10 µm or more and 200 µm or less. |