Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-23 |
filingDate |
2020-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7434bae13f84317b8a980e749f592fd7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d69df618b1b63f7b1c55163ade90c95f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52f0b654c9a90c5a85fa30e8e320c259 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8465c85ed6bb15aa69d18280fcad4b1 |
publicationDate |
2022-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20220007755-A |
titleOfInvention |
Dicing film and dicing die bonding film |
abstract |
The present invention relates to a dicing film capable of more easily picking up a diced wafer or a dicing die-bonding film including the same. |
priorityDate |
2020-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |