| abstract |
A plasma processing apparatus for vacuum processing an object disposed in a processing chamber using plasma, wherein a container body having an opening in a wall forming the processing chamber, and a slit penetrating in the thickness direction are formed to close the opening a metal plate provided in contact with the metal plate, a dielectric plate supported in contact with the metal plate and blocking the slit from the outside of the processing chamber; An antenna is provided, and hD/2>0.7 (h is the distance (mm) between the central axis of the antenna and the surface of the antenna side of the metal plate, and D is the diameter (mm) of the antenna) It is a plasma processing device. |