| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f04529fbaf306be549bda5a7d916fcf |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2021-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bce2d0d09508e12dc445f1898adcd81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfbcc534edcb68f8b41d838b4b3c15c3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad012eaf88c6154821bfda0f071c236f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3b65b2abb5237d4df1946a4eaa4e7da |
| publicationDate |
2021-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210125436-A |
| titleOfInvention |
High density printed circuit board with plating layer and manufacturing method thereof |
| abstract |
a copper layer formed on a printed circuit board; a silver plating layer formed on the copper layer and including a silver component; a palladium plating layer formed on the silver plating layer and including a palladium component; and a high-density printed circuit board having a plating layer formed on the palladium plating layer and including a gold plating layer including a gold component. |
| priorityDate |
2020-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |