| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0955bf8807610e8f0af72b9758aa4891 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-103 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2017-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fe300ee820e965e8a5ca68b8f842b5c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac5fd2a1d12192faaa486ea222213b1f |
| publicationDate |
2019-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20190020831-A |
| titleOfInvention |
Electroless Palladium / Gold Plating Process |
| abstract |
An object of the present invention is to provide an electroless palladium / gold plating process capable of selectively forming a palladium / gold plated film only on a copper surface without generating palladium precipitation anomaly even with a small single electrode or with a narrow L / S . In order to solve the above problems, the electroless palladium / gold plating process comprises immersing an insulating substrate having copper on its surface in a sulfur-containing aqueous solution containing at least one sulfur compound selected from the group consisting of thiosulfate and thiol, A step (S4) of performing surface potential adjustment processing; (S5) of performing an electroless palladium plating treatment on the insulating substrate whose surface potential of copper is adjusted to form a palladium plating film on the copper; And a step (S6) of performing electroless gold plating on the insulating substrate having the palladium plating film formed on the copper to form a gold plated film on the palladium plating film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210125436-A |
| priorityDate |
2016-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |