| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-332 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-0605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-564
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-54 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-02 |
| filingDate |
2020-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1e0d4e9caca4bb68cd0c95d39667d72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5c3b5880b10538aa0d193d2ff8cd510
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9593cabf027c62ef51aa8fe60fd1f1d5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2223968453e17f9a363483a808b0baef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_132a82959d360d4c0937bff785775f51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cf002daba07b3362f2cd158a308bead
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8faca0f148b7d398729e55807a2e354f |
| publicationDate |
2021-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210118198-A |
| titleOfInvention |
Method for Particle Removal from Wafers via Plasma Modification in Pulsed PVD |
| abstract |
Physical vapor deposition methods for reducing particulates deposited on a substrate are disclosed. The pressure during sputtering can be increased to cause agglomeration of particulates formed in the plasma. Agglomerated particulates can be transported to an outer portion of the process chamber before extinguishing the plasma, allowing the agglomerates to fall harmlessly outside the diameter of the substrate. |
| priorityDate |
2019-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |