abstract |
An object of the present disclosure is to manufacture the semiconductor element chip 1 by a method comprising irradiating a laser beam or the like to the protective film 3 on the substrate 2, making it easy to produce the protective film 3, By 3), the base material 2 and the semiconductor element chip 1 can be protected, and the protective film 3 is made easy to remove. In the present disclosure, the protective composition contains a water-soluble polyester resin (A) having a polyvalent carboxylic acid residue (a) and a polyhydric alcohol residue (b). The polyvalent carboxylic acid residue (a) includes a polyvalent carboxylic acid residue (a1) having a metal sulfonate group and a naphthalenedicarboxylic acid residue (a2). The proportion of the polyvalent carboxylic acid residue (a1) is 25 mol% or more and 70 mol% or less with respect to the polyvalent carboxylic acid residue (a). The proportion of the naphthalenedicarboxylic acid residue (a2) is 30 mol% or more and 75 mol% or less with respect to the polyvalent carboxylic acid residue (a). |