abstract |
[Problem] An object of the present invention is to provide an organic film material having excellent film formability and exhibiting high etching resistance, excellent torsion resistance and embedding characteristics, a pattern formation method using the same, and a polymer suitable for such an organic film material do it with [Solutions] A material for forming an organic film, comprising a polymer having a repeating unit represented by the following general formula (1), and an organic solvent as a material for forming an organic film. (Methylene which is the general formula (1) of, AR1, AR2 is a ring which may have a substituent, a benzene ring or naphthalene. W 1 is a divalent organic group of 2 to 20 carbon atoms that does not have an aromatic ring, constituting the organic group It may be substituted with an oxygen atom or a carbonyl group. W 2 is a divalent organic group having 6 to 80 carbon atoms and having at least one aromatic ring.) |