| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ebeb50a30d9808d1431641508db3230 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B2203-017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B2203-002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0458
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3672
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2642 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
2019-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_770a22134cd362ca03693e0dc600069f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae08bc60f830d566708e494286eb55f7 |
| publicationDate |
2021-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210030409-A |
| titleOfInvention |
Assemblies and subassemblies for thermal control of electronic devices |
| abstract |
An assembly for controlling a temperature of an apparatus comprises: a heat sink configured to be maintained at a temperature below a desired set temperature; A heater element having a surface configured to be thermally coupled to a surface of the device; And a thermally conductive pedestal interposed between the heat sink and the heater element. The heater is configured to apply heat to the device when the temperature of the device falls below a set point temperature, and when the temperature of the device is higher than the set point, heat is transferred to the heat sink through the pedestal and the heater element. I can. |
| priorityDate |
2018-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |