| abstract |
A substrate processing apparatus is disclosed. The substrate processing apparatus includes a chamber having a processing space therein, a substrate supporting unit supporting a substrate in the processing space, a gas supply unit supplying a gas into the processing space, and a plasma generating unit and a substrate supporting unit generating plasma from the gas. The ring assembly includes a ring assembly disposed to be wrapped, and the ring assembly includes a ring member, an adjustment member for adjusting the height of the ring member, and a measuring member for measuring the height of the ring member. |