| abstract |
[Task] A composition for forming an organic film, which can exhibit high etching resistance and excellent torsional resistance without damaging the original carbon content of the resin, has excellent film-forming properties, and has few outgassing sublimation components, and a pattern using the same Methods of formation and polymers suitable for such compositions are provided. [Solution means] The composition for organic film formation contains a polymer and an organic solvent containing a repeating unit represented by the following general formula (1A) as a partial structure. (In the general formula (1A), AR 1 and AR 2 are a benzene ring or a naphthalene ring which may have a substituent, W 1 is any one of the following general formula (1B), and two or more types of W 1 are used in combination W 2 is a divalent organic group having 1 to 80 carbon atoms.) (R 1 in the general formula (1B) is a monovalent organic group having an unsaturated bond having 1 to 10 carbon atoms, and R 2 is a monovalent organic group having 6 to 20 carbon atoms having one or more aromatic rings.) |