| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_154f5a8a983d88f296117dcc92946ab4 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2019-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c7cca0f29f481a4711ee382cf96d047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8838382630c4c35094b171225a69eff4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44fffc4c0f65fe3d97129d9201ac46f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c2863bb97e36eb1c5c7b72979086e3c |
| publicationDate |
2020-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200113496-A |
| titleOfInvention |
Cmp slurry composition for polishing tungsten pattern wafer and method for polishing tungsten pattern wafer using the same |
| abstract |
At least one of a polar solvent and a non-polar solvent; abrasive; At least one of the compounds of formula 1 and 2; There is provided a CMP slurry composition for polishing a tungsten pattern wafer, and a method for polishing a tungsten pattern wafer using the same, comprising tetrabutylammonium hydroxide. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115109519-A |
| priorityDate |
2019-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |