Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65e6cc42bb2719da1d60772d005416f5 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate |
2013-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0972e4b32fae2760abfee3f9aa14a7c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ecf51d7571db4f2244e6ab7df16a751 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4ba36f745b4f14ec1982e30bf12b2f2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_669893dbd1adbaef187f3ebdc2993089 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9d511dd5d1f95784e9eb7e29f02a70a |
publicationDate |
2015-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20150058586-A |
titleOfInvention |
Additive composition of high aspect ratio polishing slurry and high aspect ratio polishing slurry composition comprising the same |
abstract |
The present invention relates to a slurry additive composition for high stage abrasive and a slurry composition for high stage abrasive comprising the same, wherein the slurry additive composition for high stage abrasive according to the present invention and the slurry composition for high speed abrasive comprising the same, The step of the patterned wafer having a portion of the patterned wafer is removed and planarized, and after the planarization, the polishing surface is protected as the polishing rate becomes very slow. Also, the high-speed polishing performance of the high-stage concave-convex portion is maintained regardless of the content of the additive composition and the automatic polishing stop function is controlled according to the content of the additive composition, so that the process margin is excellent and the production time is shortened. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020517117-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113637412-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200113496-A |
priorityDate |
2013-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |