| abstract |
With respect to 100 parts by weight of the inorganic acid, about 0.01 parts by weight to about 0.5 parts by weight of colloidal silica; About 0.01 parts by weight to about 30 parts by weight of an ammonium-based additive; And about 20 parts by weight to about 50 parts by weight of a solvent. When the etchant composition for silicon nitride is used, silicon nitride can be etched and removed at high speed while having excellent etch selectivity even at high temperatures. |