| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_154f5a8a983d88f296117dcc92946ab4 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-149 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F11-14 |
| filingDate |
2018-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c7cca0f29f481a4711ee382cf96d047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dfc37c60c26e93f81e0a048a50e40fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_047a578127f648cdf32e6aeacdb6a6f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c9819e3235b016799ca2c2dd6193ee8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4b5b07ce9f8f9e28a1c967a5e4979ed |
| publicationDate |
2020-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200017269-A |
| titleOfInvention |
Cmp slurry composition for polishing copper layer and method for polishing copper layer using the same |
| abstract |
At least one of a polar solvent and a nonpolar solvent; Metal oxide abrasives; Glycine; Histidine; And it provides a copper film polishing CMP slurry composition comprising an imidazole compound and a copper film polishing method using the same. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023190263-A1 |
| priorityDate |
2018-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |