http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190101576-A

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filingDate 2018-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20190101576-A
titleOfInvention Photosensitive resin composition and insulation layer formed from the same
abstract The photosensitive resin composition of the embodiments of the present invention comprises a polybenzoxazole precursor, a photosensitizer and a solvent mixture. The solvent mixture may contain 25 to 45 parts by weight of the first solvent having a boiling point of 100 to 140 ° C., 35 to 65 parts by weight of the second solvent having a boiling point of 140 to 160 ° C., and a boiling point of 160 to 200 ° C. in 100 parts by weight of the solvent mixture. 10-30 weight part of third solvents are included. The photosensitive resin composition can be used to form an insulating film with improved dry staining.
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