| abstract |
The rinse composition for a silicon wafer of the present invention is a rinse composition for a silicon wafer comprising a water-soluble polymer and water, wherein the water-soluble polymer comprises the water-soluble polymer, silica particles, water and, if necessary, hydrochloric acid or ammonia, The zeta potential Z of the water-soluble polymer-containing silica aqueous dispersion (aqueous dispersion S) having a concentration of the water-soluble polymer of 0.1% by mass, a concentration of the silica particles of 0.1% by mass and a pH at 25 캜 of 7.0, (Z - Z) of the zeta potential Z 0 of the silica aqueous dispersion (aqueous dispersion S 0 ) which is composed of hydrochloric acid or ammonia and which has a concentration of the silica particles of 0.1% by mass and a pH of 7.0 at 25 ° C, 0 ) is 25 ㎷ or less. |