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filingDate 2013-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2014-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014154707-A
titleOfInvention Polishing liquid, polishing method and silicon wafer manufacturing method
abstract A polishing liquid capable of reducing defects while suppressing a decrease in smoothness and an increase in foreign matters in polishing an object to be polished containing silicon. A polishing liquid for polishing an object to be polished containing silicon, which contains abrasive grains, hydroxypropylmethylcellulose, a surfactant, and water, and has a pH of 4.5 or more and 8.0. Less than the polishing liquid. [Selection figure] None
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