| abstract |
An embodiment includes a substrate; A plurality of semiconductor structures disposed on the substrate; And an insulating layer disposed on the plurality of semiconductor structures, wherein the substrate includes a groove disposed between the plurality of semiconductor structures, the insulating layer including a first insulating layer disposed on the plurality of semiconductor structures, And a second insulating layer disposed in the groove, wherein the first insulating layer and the second insulating layer are connected to each other, and a manufacturing method thereof. |