http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190040766-A

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filingDate 2017-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c786cc42b8e0cfcbb21db177570c6df9
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publicationDate 2019-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20190040766-A
titleOfInvention Method for Etching of Palladium Thin Films
abstract The present invention relates to a method of etching a palladium thin film, and more particularly, to a method and apparatus for etching a palladium thin film by applying an optimal etching process condition including a kind of an etching gas and a concentration of an etching gas to a palladium thin film, The present invention relates to a method of etching a palladium thin film capable of providing a rapid etching rate and a high anisotropic etching profile as well as mitigating plasma damage to the metal oxide semiconductor layer under the palladium thin film without residues.
priorityDate 2017-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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