abstract |
The thermosetting resin composition includes an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and having a weight average molecular weight of 1,000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition is preferably substantially free from a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition is used, for example, in the formation of a cured film on a flexible printed wiring board. |