| abstract |
PROBLEM TO BE SOLVED: The present invention has an excellent tackiness after drying and has a photosensitivity so that it can be finely processed. The resulting cured film is excellent in flexibility, flame retardancy and electrical insulation reliability, and after curing. An object of the present invention is to provide a photosensitive resin composition, a resin film, a cured film, and a printed wiring board with a cured film with a small warpage of the substrate. SOLUTION: Photosensitivity comprising at least (A) a binder polymer, (B) crosslinked polymer particles containing a flame retardant therein, (C) a radical polymerizable compound, and (D) a photopolymerization initiator. The said subject can be solved by using a resin composition. [Selection figure] None |